Footprint naming conventions

This section describes the conventions for naming of footprints used in PCB (and gEDA/gaf).
The purpose of the naming convention is to establish a standard to maintain the same naming convention through the different phases of the CAD chain. This helps in ensuring that the collaborative effort of gEDA/gaf is not lost.

Notes

Integrated circuit packages

Integrated circuit SMT packages

Basic semiconductors

Basic SMT semiconductors

Passive components

Passive SMT components